MMAE Seminar - Dr. D. Gary Harlow - Probability and Statistical Modeling: Additive Manufacturing

Armour College of Engineering's Mechanical, Materials, and Aerospace Engineering Department will welcome Dr. D. Gary Harlow, Professor and Chair of the Department of Mechanical Engineering and Mechanics at Lehigh University, on Wednesday, March 27th, to present his lecture, Probability and Statistical Modeling: Additive Manufacturing.

Abstract

Additive manufacturing is a complex multi–parameter process. Electron beam additive manufacturing of titanium, which consists of a multitude of layers of deposited metal, exhibits significant variability in many key aspects. In an attempt at establishing consistent and predictable material properties from these builds, process variables, geometry, and microstructure must be considered. The primary variables are modeled with an appropriate cumulative distribution function. Subsequently, these distributions functions are incorporated into a proposed physically based model for yield strength. The main purpose of this analysis is to begin to characterize the yield strength, especially in the extreme lower tail which is critical for high reliability estimation and prediction.

Biography

D. Gary Harlow is a Professor in Mechanical Engineering and Mechanics at Lehigh University in Bethlehem, PA. Since 2008 he has been the department chair. He received his BA in Mathematics (1973) from Western Kentucky University and his MS (1976) and PhD in Applied Probability and Stochastic Processes (1977) from Cornell University. His research has primarily centered on scientifically and mechanistically based probability modeling and statistical analyses. Specifically, his research has included modeling of failure processes (creep, creep-fatigue, very high cycle fatigue, corrosion pitting, and corrosion fatigue) in materials (aluminum alloys, steels, and composites); stochastic fracture mechanics; mechanical and system reliability; applications of stochastic processes; and methods in applied statistics for materials characterization. His research has been sponsored throughout his career by the NSF, FAA, DoD, and DARPA.